Method for producing curved display

ABSTRACT

The present invention relates to a method for producing a curved display, which produces a curved display using a flat display module. A method for producing a curved display, according to one embodiment of the present invention, is to produce a curved display using a flat display module, the method comprising the steps of: masking the display module with a masking element so as to cover parts of the upper plate and the lower plate thereof, in which a masking area of the upper plate and a masking area of the lower plate are disposed asymmetrically up and down; etching the display module to a preset thickness so as to reduce the thickness of the display module except for the masking areas in the masked display module; removing the masking element from the display module after the etching step; and curving the display module.

TECHNICAL FIELD

The present invention relates to a method for producing a curveddisplay, more particularly to a method of manufacturing a curved displayby using a planar display module.

BACKGROUND ART

Advances in display technology have allowed the development and use ofvarious types of display devices. One such device is the liquid crystaldisplay, which uses liquid crystal to present images.

The liquid crystal panel of a typical liquid crystal display (LCD) mayinclude two substrates and a layer of liquid crystal having the propertyof dielectric anisotropy positioned between the substrates. A picturemay be obtained by applying an electric field to the liquid crystallayer and adjusting the intensity of the electric field to adjust thetransmittance of light that passes through the liquid crystal layer. Theliquid crystal display is a representative example of an easily portableflat panel display (FPD), and the TFT-LCD type, which uses a thin-filmtransistor (TFT) as the switching component is widely being used.

Among the two substrates arranged facing each other in a liquid crystalpanel, the lower substrate may have multiple display signal lines, i.e.gate lines and data lines, as well as multiple thin-film transistors andpixel electrodes, etc., formed thereon, while the upper of the twosubstrates may have a color filter and a common electrode formedthereon.

Such a liquid crystal panel is typically manufactured in a flat form,and therefore in cases where a display having a curved form is needed,the typical flat liquid crystal panel cannot be used. The related priorart can be found in Korean Patent Publication No. 10-2012-0013265.

There has also been developed a flexible liquid crystal panel, whichemploys substrates of a flexible material instead of the glasssubstrates of the liquid crystal panel to be capable of bending when anexternal force is applied.

However, the conventional flexible liquid crystal panel may entail adifficult manufacturing procedure as well as a high manufacturing cost.

Thus, there is need for research on a method of manufacturing a curveddisplay panel that allows an easy manufacturing procedure and a lowmanufacturing cost.

DISCLOSURE Technical Problem

An objective of the present invention is to provide a method ofmanufacturing a curved display with which a planar display module can beused to manufacture a curved display more effectively.

Another objective of the present invention is to provide a method ofmanufacturing a curved display that can reduce damage when manufacturingthe curved display using a planar display module.

Another objective of the present invention is to provide a method ofmanufacturing a curved display with which a curved display can bemanufactured using a planar display module without additional elements.

Technical Solution

To achieve the objectives above, an embodiment of the present inventiondiscloses a method of manufacturing a curved display from a planardisplay module, where the method includes: masking the display modulewith a masking element such that portions of an upper substrate and alower substrate of the display module are covered, with the masking areaof the upper substrate and the masking area of the lower substratepositioned asymmetrically with respect to an up-down direction; etchingthe display module such that portions of the masked display module otherthan the masked portions are decreased in thickness to a predeterminedthickness; removing the masking element from the display module afterthe etching; and bending the display module into a curved plane.

To achieve the objectives above, an embodiment of the present inventiondiscloses a method of manufacturing a curved display from a planardisplay module, where the method includes: masking the display modulewith a masking element such that portions of an upper substrate and alower substrate of the display module are covered; etching the displaymodule such that portions of the masked display module other than themasked portions are decreased in thickness to a predetermined thickness;removing the masking element from the display module after the etching;bending the display module into a curved plane; and attaching the bentdisplay module to a protective element having a particular radius ofcurvature by using a double-sided tape of a particular thickness, wherea first adhesion surface of the double-sided tape is adhered to anetched surface of the bent display module, and a second adhesion surfaceof the double-sided tape is adhered to a surface of the protectiveelement.

Advantageous Effects

A method of manufacturing a curved display according to an embodiment ofthe present invention can reduce damage to the etched display modulewhile the curved display is being manufactured by using a planar displaymodule.

Also, an embodiment of the present invention can reduce themanufacturing cost, as the curved display is manufactured with a singleetching process.

Also, an embodiment of the present invention can reduce themanufacturing cost, since the curved display can be manufactured using aplanar display module without additional elements.

DESCRIPTION OF DRAWINGS

FIG. 1 is a perspective view of a display module associated with anembodiment of the present invention.

FIG. 2 is a cross-sectional side view of the display module after amasking operation is performed according to a method of manufacturing adisplay associated with an embodiment of the present invention.

FIG. 3 is a cross-sectional side view of the display module after anetching step has been performed according to a method of manufacturing adisplay associated with an embodiment of the present invention.

FIG. 4 is a cross-sectional side view of the display module with areinforcing material attached, after the etching step has beenperformed, according to a method of manufacturing a display associatedwith an embodiment of the present invention.

FIG. 5 is a cross-sectional side view of the display module after themasking and etching steps have been performed according to a method ofmanufacturing a display associated with an embodiment of the presentinvention.

FIG. 6 illustrates the etched display module overlaid with a coveraccording to a method of manufacturing a display associated with anembodiment of the present invention.

FIG. 7 illustrates the securing of the display module to a protectiveelement according to a method of manufacturing a display associated withan embodiment of the present invention.

FIG. 8 is a side view of the display module secured to a protectiveelement according to a method of manufacturing a display associated withanother embodiment of the present invention.

FIG. 9 illustrates the arrangement of FIG. 8 as seen from above.

DESCRIPTION OF REFERENCE NUMERALS

100: display module

110: first substrate

120: second substrate

130: liquid crystal layer

150: tap

151: circuit board

160: sealant

170: first masking element

171: second masking element

180: reinforcing material

300: cover

310, 320, 330, 340, 350: cover element

700, 800: protective element

710: screw hole

810: double-sided tape

820: sealant

Mode for Invention

A method of manufacturing a curved display associated with an embodimentof the present invention is described below with reference to theaccompanying drawings.

A method of manufacturing a curved display according to an embodiment ofthe present invention can include a method of manufacturing a displayhaving a particular curved form by using a planar display module.

Examples of the planar display module can include an LCD panel, anorganic electroluminescent panel, etc. An LCD panel can have a liquidcrystal layer between the substrates, while an organicelectroluminescent panel can have an organic electroluminescent layerbetween the substrates.

FIG. 1 is a perspective view of a display module associated with anembodiment of the present invention.

As illustrated in the figure, the display module 100 can be an LCD panelthat includes a first substrate 110, a second substrate 120, and aliquid crystal layer 130 positioned between the first substrate 110 andsecond substrate 120, with taps 150 for electrical connections attachedto the LCD panel.

Here, if one of the first substrate 110 and second substrate 120 is athin-film transistor substrate, the other can be a color filtersubstrate, and the liquid crystal layer 130 can be composed of polymersarranged vertically or horizontally.

Also, the color filter substrate can include multiple filters havingvarious functions laminated in an overlapping manner, and a hermeticseal (not shown) can be applied between the first substrate 110 andsecond substrate 120 to prevent the liquid crystal layer 130 fromleaking out.

A tap 150 can be an electrode that is electrically connected to the oneof the first substrate 110 and second substrate 120 serving as thethin-film transistor substrate, where the tap 150 can be configured inthe form of a film to be capable of bending flexibly, and the tap 150can have an IC mounted thereon.

Also, a tap 150 can include a circuit board 151 that is composed ofvarious semiconductors and electrical components and is installed at adistal end of the electrode to control the thin-film transistorsubstrate.

Although the descriptions below use an example in which the displaymodule 100 is an LCD, the display module 100 can also be a plasma type,OLED type, PLED type, etc.

The display module 100 can further include a polarizing film (notshown), which can be attached to the first substrate 110 or secondsubstrate 120 or be included in the display module 100 in the form of astacked layer.

FIG. 2 is a cross-sectional side view of the display module after amasking operation is performed according to a method of manufacturing adisplay associated with an embodiment of the present invention. In caseswhere a polarizing film is attached to the display module 100, anoperation of removing the polarizing film (not shown) can be performedfirst. The polarizing film can be reattached after the etching process.This is because the polarizing film may hinder the etching.

According to an embodiment of the present invention, all sides (foursides) of the display module 100 can be masked, or some of the sides canbe masked. For example, it is possible to selectively perform themasking only on the side where the taps 150 are attached and the twosides neighboring the side where the taps 150 are attached.

FIG. 2 is a cross-sectional view of the display module 100 showing theside neighboring the side where the taps 150 are attached.

As illustrated in the figure, the lower substrate positioned below theliquid crystal layer 130 in the display module 100 may be the firstsubstrate 110, and the upper substrate positioned over the liquidcrystal layer 130 may be the second substrate 120. The thickness of thedisplay module 100 may be represented as T. The T is the thickness ofthe display module 100 before the etching process. The display module100 can have the edge portions of the liquid crystal layer 130 sealedwith a sealant 160 to prevent the liquid crystal layer 130 from leakingout.

Near the edges of the upper substrate 120 and the lower substrate 110 ofthe display module, first masking elements 170 can be adhered formasking. A first masking element 170 can be an acid-resistant maskingtape that can be readily attached to the substrate.

The masking area of the upper substrate 120 and the masking area of thelower substrate 110 where the first masking elements 170 are attachedcan be positioned asymmetrically. The masking area of the uppersubstrate 120 represents the area of the upper substrate 120 where thefirst masking element 170 is attached, and the masking area of the lowersubstrate 110 represents the area of the lower substrate 110 where thefirst masking element 170 is attached. For example, the masking can beperformed such that a vertical projection area, which would be formed ifthe masking area of the upper substrate 120 were by vertically projectedonto the lower substrate 110, does not overlap the masking area of thelower substrate 110.

According to an embodiment of the present invention, a procedure ofcovering the taps 150 attached to the display module 100 with a secondmasking element 171 for protection can precede the attaching of thefirst masking elements 170. For a more convenient covering procedure andfor reductions in cost, an amorphous plastic element can be used for thesecond masking element 171. For example, the amorphous plastic elementcan be a vinyl bag.

That is, if the first masking elements 170 are attached to the maskingarea of the upper substrate 120 and the area of the lower substrate 110while the second masking element 171 is covering a region from themasking area of the upper substrate 120 to the masking area of the lowersubstrate 130, then the second masking element 171 may be secured to theupper substrate 120 and lower substrate 110.

Also, the masking can include masking the areas of the upper substrate120 and lower substrate 110 where circuit patterns are formed, in orderto protect the patterns.

The circuit patterns can be arranged in the edge areas of the uppersubstrate 120 and lower substrate 110. This is to make the effectivedisplay area, where the video signals are actually displayed, as wide aspossible.

In one example, the taps 150 can be attached over the lower substrate110. In this case, the lower substrate 110 may be formed longer than theupper substrate 120 and the liquid crystal layer 130 along the sidewarddirection, and the upper substrate 120 and the liquid crystal layer 130may not be stacked vertically above the taps 150. Also, the maskingareas of the lower substrate 110 and upper substrate 120 where the firstmasking elements 170 are attached can include edge areas that includethe respective end portions. The end portion can be the distal portionof the lower substrate 110 or upper substrate 120, and when illustratingthe lower substrate 110 and the upper substrate 120 in a plan view, caninclude the edge.

A reason for masking the upper substrate and lower substrateasymmetrically as above is because asymmetrical masking leads to lessdamage during the bending of the display module (e.g. LCD) for forming acurved shape compared to symmetrical masking.

FIG. 3 is a cross-sectional side view of the display module after anetching step has been performed according to a method of manufacturing adisplay associated with an embodiment of the present invention.

As illustrated in the figure, an etching step can be performed such thatthe thickness T of the display module 100 masked with the maskingelements 170, 171 is reduced to a predetermined thickness T1. Afterperforming the etching step, the unetched areas (areas that were notetched) of the upper substrate 120 and lower substrate 110 may beasymmetrical along the up-down direction. The above etching step can beperformed by way of a chemical reaction triggered by an etching fluid.

FIG. 4 is a cross-sectional side view of the display module with areinforcing material attached, after the etching step has beenperformed, according to a method of manufacturing a display associatedwith an embodiment of the present invention.

As illustrated in the figure, after the etching process, a reinforcingmaterial 180 can be attached to cover the unetched areas, or thereinforcing material 180 can be attached to at least a partial area ofthe unetched areas. The reinforcing material 180 can include at leastone of silicone and liquid adhesive. By attaching the reinforcingmaterial as above, it is possible to reduce damage to the display module100 during the operation of bending the etched display module 100 into acurved shape or during transport of the display module 100.

When the etching step has been completed, the masking elements 170, 171can be removed from the display module 100.

FIG. 5 is a cross-sectional side view of the display module after themasking and etching steps have been performed according to a method ofmanufacturing a display associated with an embodiment of the presentinvention. FIG. 5 shows the arrangement after the masking and etchingsteps have been performed for a display module to which there are notaps attached.

FIG. 5(a) is a cross-sectional side view of the display module after themasking step has been performed.

As illustrated in the figure, the lower substrate positioned below theliquid crystal layer 130 in the display module 100 may be the firstsubstrate 110, and the upper substrate positioned over the liquidcrystal layer 130 may be the second substrate 120. The thickness of thedisplay module 100 is represented as T. The T is the thickness of thedisplay module 100 before the etching process.

In this embodiment, the masking step can be performed using only thefirst masking elements 170. The first masking elements 170 can beattached near the edges of the upper substrate 120 and lower substrate110 of the display module for masking. A first masking element 170 canbe an acid-resistant masking tape that can be readily attached to thesubstrate. The masking area of the upper substrate 120 and the maskingarea of the lower substrate 110 where the first masking elements 170 areattached can be positioned asymmetrically.

Also, the masking can include masking the areas of the upper substrate120 and lower substrate 110 where circuit patterns are formed, in orderto protect the patterns.

A reason for masking the upper substrate and lower substrateasymmetrically as above is because asymmetrical masking leads to lessdamage during the bending of the display module (e.g. LCD) for forming acurved shape compared to symmetrical masking.

FIG. 5(b) is a cross-sectional side view of the display module after theetching step has been performed.

As illustrated in the figure, an etching step can be performed such thatthe thickness T of the display module 100 masked with the maskingelements 170 is reduced to a predetermined thickness T1. Afterperforming the etching step, the unetched areas (areas that were notetched) of the upper substrate 120 and lower substrate 110 may beasymmetrical along the up-down direction.

When the etching step has been completed, the masking elements 170 canbe removed from the display module 100.

When the operation of removing the masking elements of the displaymodule 170 is completed as shown in FIGS. 2 to 4 or as shown in FIG. 5,the display module 100 can be bent into an arbitrary curved plane tocomplete the curved display.

The curved plane can include not only a simple “C”-shaped curved planehaving one point of inflexion but also an “S”-shaped curved plane havingtwo points of inflexion as well as a wavering curved plane having manypoints of inflexion.

After removing the masking elements from a display module of the typeshown in FIGS. 2 to 4 or from a display module of the type shown in FIG.5 is complete, an operation can be performed for securing the displaymodule to a cover. The operation of securing the display module 100 tothe cover can be performed simultaneously with the operation of bendingthe display module 100 or can be performed after the operation ofbending the display module 100.

A general curved display may have the rear cover shaped as a curvedplane. Therefore, in order to mount a board (e.g. signal processingboard, power board, etc.) of which the side has a linear shape, aseparate bracket having a planar shape may additionally be required.

However, with an embodiment of the present invention, the cover can bedesigned with a linear component, so that boards that have sides formedin a linear shape can be readily mounted onto the cover without aseparate bracket.

FIG. 6 illustrates the etched display module overlaid with a coveraccording to a method of manufacturing a display associated with anembodiment of the present invention. FIG. 6 illustrates the displaymodule 100 with the etched shapes omitted.

As illustrated in the figure, the cover 300 can be assembled byconnecting five cover elements 310, 320, 330, 340, 350. Although theillustrated embodiment only shows five cover elements, the number ofcover elements is not limited to five.

Each of the cover elements 310, 320, 330, 340, 350 may be shaped like aplate and may have its sides formed in a linear shape. Two neighboringcover elements (e.g. 310 and 320) may have their two sides forming aparticular angle other than 180 degrees. By connecting two neighboringcover elements in this manner, the cover 300 can be designed such thatthe overall shape of the sides approximates a curve.

Reference numeral 200 represents an element placed at the front of thedisplay module 100 and can include a front bezel, touch panel, glass,etc.

The various types of plate-shaped boards 400 having sides formed inlinear shapes can be mounted on a flat area on any one of the multiplecover elements.

By thus designing the cover 300 to be assembled from a multiple numberof plate-shaped cover elements of which the sides are shaped as lines,it is possible to mount plate-shaped boards 400 on the cover 300 withouta separate linearly shaped bracket.

Although it is not shown in the drawings, one embodiment of the presentinvention can have the cover 300 composed of one cover element that hasa plate-like shape and has sides formed in linear shapes. In this case,the one cover element can be folded into multiple areas. The angleformed between each neighboring area can be less than 180 degrees. Bythus folding one cover element such that it is divided into multipleareas, the cover 300 can be designed such that the overall shape of thesides approximates a curve. Each of the multiple areas formed by foldingthe cover element can have a plate-like shape with the side forming alinear shape. Thus, various plate-shaped boards 400 can be mounted on aflat portion on any one of the multiple areas. By thus designing thecover 300 to be formed by a plate-shaped cover element having a linearside bent into multiple areas, it is possible to mount plate-shapedboards 400 on the cover 300 without a separate linearly shaped bracket.

According to an embodiment of the present invention, a protectiveelement can be used for reducing the risk of damage to the unetchedportions, which are the most vulnerable portions, during transport ofthe etched display module 100 or during a procedure of assembling otherparts for actual operation.

FIG. 7 illustrates the securing of the display module to a protectiveelement according to a method of manufacturing a display associated withan embodiment of the present invention. FIG. 7 illustrates the displaymodule 100 with the etched shapes omitted.

As illustrated in the figure, the display module 100 can be secured to aprotective element 700 arranged at the upper surface or lower surface.The display module 100 can be secured to the protective element 700 byway of screws (not shown) fitted into screw holes 710. The protectiveelement 700 can have relatively weaker brittleness compared to theetched display module 100.

The protective element 700 can include a metal frame and a frame of atransparent material having a particular radius of curvature.

In cases where a metal frame is used for the protective element 700, themetal frame can be fabricated to have a small thickness of about 0.1˜1T.Here, T is the thickness of the display module 100 before the etching.

As the metal frame is opaque, the metal frame can be fabricated suchthat the active region of the etched display module 100 is open. Forexample, the metal frame can be fabricated such that the area other thanthe boundary is opened, so that the effective display area of thedisplay module 100 may be shown to the outside. The etched displaymodule 100 may be attached to an upper surface or a lower surface of themetal frame using liquid adhesive or silicone, etc.

The etched display module 100 can be secured during the transport of theetched display module 100 or during a procedure of assembling otherparts for actual operation, and since metal is used, damage to the mostvulnerable portions, i.e. the unetched portions, can be prevented. Inparticular, since a force is applied equally to the unetched portionsduring the bending of the display module 100, this can be very useful inprotecting the etched display module 100.

In cases where a frame made of a transparent material is used for theprotective element 700, the frame of a transparent material can befabricated to have a particular radius of curvature. Examples of atransparent material can include glass, acrylic, etc. The thickness ofthe transparent frame can be 0.1˜5T.

As the frame made of a transparent material is transparent, it may notbe necessary to perform a separate operation for providing an openregion.

The etched display module 100 can be attached to an upper surface or alower surface of the transparent frame using liquid adhesive orsilicone, etc.

FIG. 8 is a side view of the display module secured to a protectiveelement according to a method of manufacturing a display associated withanother embodiment of the present invention, and FIG. 9 illustrates thearrangement of FIG. 8 as seen from above.

As illustrated in the figures, the display module 100 can be secured tothe protective element 800, which may be arranged at an upper surface ora lower surface, by using a double-sided tape 810 having a certainthickness. The protective element 800 can have a particular radius ofcurvature. The double-sided tape 810 can have two adhesion surfaces. Afirst adhesion surface of the double-sided tape 810 can be adhered onlyto an etched surface of the bent display module 100 without beingadhered to an unetched surface. Also, a second adhesion surface of thedouble-sided tape 810 can be adhered to a surface of the protectiveelement 800. The protective element 800 used here can be the same as theprotective element 700 described above with reference to FIG. 7.

The thickness of the double-sided tape 810 can be determined such thatan empty space may be formed between a vertically downward area belowthe surface of the protective element 800 and a vertically upward areaabove the unetched surface of the bent display module 100. However, ifthe thickness of the double-sided tape 810 is too great, the separationdistance of the unetched surface of the bent display module 100 can betoo large. This can cause damage to the display module 100. As such, thethickness of the double-sided tape 810 can be determined such that theseparation distance between the surface of the protective element 800and the unetched surface of the display module 100 is not excessivelylarge. For example, the thickness of the tape 810 can be determined suchthat the separation distance does not exceed the thickness of thesubstrate 110 or 120 of the display module 100.

In order that a constant distance may be maintained between theprotective element 800 and the display module 100, the double-sided tape810 can be adhered to all four edge areas of the display module 100, asillustrated in FIG. 9.

After the operation of adhering the protective element 800 with thedisplay module 100 using the double-sided tape 810, a sealing operationcan be added.

The perimeter portion of the double-sided tape 810 that has secured thedisplay module 100 with the protective element 800 can be sealed by wayof a sealant 820. This sealing can reduce the risk of damage to thedisplay module 100.

According to an embodiment of the present invention, at least one of thedouble-sided tape 810 and the sealant 820 can be made of an opticallyopaque material. Using an optically opaque material for at least one ofthe double-sided tape 810 and the sealant 820 in this manner can helpavoid the problem of light leakage, which describes undesired lightbeing visible at the front when the backlight and the display module 100are actually assembled. For example, at least one of the double-sidedtape 810 and the sealant 820 can be made to have a black tone color.

As described above, a method of manufacturing a curved display accordingto an embodiment of the present invention can reduce damage to theetched display module during the manufacture of the curved display usinga planar display module.

Also, an embodiment of the present invention can reduce manufacturingunit cost, as the curved display can be manufactured with a singleetching process.

Also, an embodiment of the present invention can reduce manufacturingcost, as the curved display can be manufactured using a planar displaymodule without a separate element.

The method of manufacturing a curved display described above is notlimited to the compositions and methods of the embodiments set forthabove but rather can include combinations of all or parts of differentembodiments so that numerous variations of the embodiments may beprovided.

1. A method of manufacturing a curved display from a planar displaymodule, the method comprising: masking the display module with a maskingelement such that portions of an upper substrate and a lower substrateof the display module are covered, a masking area of the upper substrateand a masking area of the lower substrate positioned asymmetrically withrespect to an up-down direction; etching the display module such thatportions of the masked display module other than the masked portions aredecreased in thickness to a predetermined thickness; removing themasking element from the display module after the etching; and bendingthe display module into a curved plane.
 2. The method of manufacturing acurved display according to claim 1, wherein a vertical projection arearepresenting a vertical projection of the masking area of the uppersubstrate onto the lower substrate does not overlap the masking area ofthe lower substrate.
 3. The method of manufacturing a curved displayaccording to claim 1, wherein the masking comprises: covering thedisplay module with an amorphous plastic element to protect a tapattached to the display module; and securing the plastic element to theupper substrate and lower substrate by using an adhesion element, andwherein the adhesion element is attached at positions where portions ofthe upper substrate and lower substrate are covered.
 4. The method ofmanufacturing a curved display according to claim 1, further comprising:attaching a reinforcing material to at least a portion of an unetchedarea, after the etching.
 5. The method of manufacturing a curved displayaccording to claim 4, wherein the reinforcing material comprises atleast one of liquid adhesive and silicone.
 6. The method ofmanufacturing a curved display according to claim 1, wherein any oneboard of the upper substrate and lower substrate of the display moduleis formed longer than the other board and a liquid crystal layer, andeach of the masking areas of the upper substrate and lower substratemasked by the masking element includes an edge area including an endportion.
 7. A method of manufacturing a curved display from a planardisplay module, the method comprising: masking the display module with amasking element such that portions of an upper substrate and a lowersubstrate of the display module are covered; etching the display modulesuch that portions of the masked display module other than the maskedportions are decreased in thickness to a predetermined thickness;removing the masking element from the display module after the etching;bending the display module into a curved plane; and attaching the bentdisplay module to a protective element by using a double-sided tape, theprotective element having a particular radius of curvature, thedouble-sided tape having a particular thickness, wherein a firstadhesion surface of the double-sided tape is adhered to an etchedsurface of the bent display module, and a second adhesion surface of thedouble-sided tape is adhered to a surface of the protective element. 8.The method of manufacturing a curved display according to claim 7,wherein the surface of the protective element and an unetched surface ofthe bent display module are separated.
 9. The method of manufacturing acurved display according to claim 7, further comprising: sealing aperimeter portion of the double-sided tape by using a sealant.
 10. Themethod of manufacturing a curved display according to claim 9, whereinat least one of the double-sided tape and the sealant comprises anoptically opaque material.
 11. The method of manufacturing a curveddisplay according to claim 7, wherein the protective element has aweaker brittleness than the etched display module.